LCD Module(LCM) has 4 parts: LCD screen, LED backlight, IC and PCB (maybe a plastic shell). We can simply consider that it has two parts: LCD screen and LED backlight because we can see from the appearance that they are the main constituents. It can be divided into COB(chip on board), COG(chip on glass) and COF(chip on film) based on the position of chip. It can also be divided into graphic LCD module and character LCD module according to the resolution and character count.
Goto Dianguang Hi Tech to know more.
COB is the abbreviation for &#;Chip On Board&#;, which is the most common way of processing the drive circuit board of LCM. The IC is attached directly to a specific location on the PCB with a sticky piece of plastic. See the picture below and the IC is under the black plastic. The electrodes of the chip are connected to the corresponding pads of the PCB board with aluminum wire by a soldering machine. And they are covered by a sticky piece of plastic on the surface.
COB LCD module is the most reliable technology which requires high precision equipment and a complicated processing procedure. It uses PIN or conductive rubber strip to connect and fasten the LCD screen, LED backlight and PCB all together, so it can&#;t be disconnected. It is very reliable and it can&#;t be damaged under normal circumstances. But if it is damaged, unfortunately, it can&#;t be repaired. It is an obsolete technology since it is too big and it is being replaced by COG LCD module.
COG is the abbreviation for &#;Chip On Glass&#;, where IC is bound to the ITO glass directly. Please see the picture below. It can greatly reduce the size of the LCD module and is easy for mass production of consumer electronic products, such as: mobile , PDA and other portable products.
COG LCD module doesn&#;t need a PCB. It is cheaper, isn&#;t it? I am sorry to tell you that it is not true. Actually, COG needs a dedicated glass mold and a dedicated mold of LCD FPC which COB doesn&#;t need. Maybe it needs a dedicated mold of light guide plate and a dedicated mold of backlight FPC because of its special structure. Thus, the tooling fee of COG is the most expensive among the three of them. If the quantity you want is only 1,000 pieces, the unit price will be incredibly high because of the tooling fee. At the same time, the tooling fee can be almost negligible if the order quantity is very large, say like 100 thousand, 1 million.
Is it reliable? Of course, it is very reliable. COB is the most reliable one. The reasons I think why COG is popular are that it can save a lot of space by concentrating all the functions on a single IC and it is cost-saving when the quantity is large. It is extremely important for modern portable electronic products which require a small volume.
COF is the abbreviation for &#;Chip On Film&#;, where IC is bound to a flexible film conveyor belt directly. Please see the picture below. It can greatly reduce the size of the LCD module, too.
We can barely see COF LCD module since no one makes it, I think it is best that we just follow the industrial tradition. It is really expensive if you want to make some special. Thus, if you really want to save space, I strongly suggest you choosing COG instead of COF.
Hengyuda
·
Follow
3 min read
·
Jul 6,
--
Are you interested in learning more about COG Segment LCD? Contact us today to secure an expert consultation!
http://www.highlystarelec.com
COG is English, &#;Chip On Glass&#; acronym, the chip is directly bound to the glass. This installation can greatly reduce the volume of the entire LCD module, and easy to mass production, suitable for consumer electronic products for LCD, such as: mobile phones, PDA and other portable electronic products. This installation, driven by IC manufacturers, will be the main connection between IC and LCD in the future. COG stands for Chip on Glass. There are many different types of displays. COB (Chip on Board), COF (Chip on Flex), TAB (Tape automated bonding) and COG. This is an LCD technology where the controller chip used to drive the LCD is mounted directly onto the LCD glass. Mounting the controller directly onto the LCD glass allows the module to be built without the need for a PCB. The three main components of a chip on glass is the glass, the controller driver chip, and the cable.
As a general rule the cost of a COG is less than that of a COB. Without being mounted to a circuit board, COG displays do not come equipped with mounting holes. Instead the COG display is mounted to the chassis if the manufacturer&#;s product uses double-sided tape.
FOG is English, &#;Film On Glass&#; acronym, the FPC is directly bound to the glass.
COB is the abbreviation of English &#;Chip On Board&#;, that is, the chip is fixed (Bonding) on the PCB, which can save the PCB board and other materials, can greatly reduce the volume, at the same time, the price can also reduce the cost. Since IC manufacturers are reducing the production of QFP (SMT) packages in LCD control and related chip production, the traditional SMT approach will be gradually replaced in future products.
COF is English, &#;Chip On Film&#; acronym, the chip is directly installed on the flexible PCB. This connection has a high degree of integration, and the peripheral components can be installed on the flexible PCB with IC.
TAB is the abbreviation of English &#;Tape Aotomated Bonding&#;, that is, anisotropic conductive adhesive bonding. The IC encapsulated in TCP (Tape Carrier Package carrying package) is fixed on LCD and PCB by anisotropic conductive adhesive, respectively. This installation method can reduce the LCM weight, volume, convenient installation, high reliability!
What are the COG and COB in the LCD module?
It is the abbreviation of &#;Chip On Glass&#; in English, that is, the chip is directly bonded to glass by ACF (Anisotropic Conductive Film). This installation method can greatly reduce the size of the entire LCD module, and is lower cost than the TAB method, and is easy to mass-produce. It is applicable to LCDs for consumer electronic products, such as mobile phones, PDAs, MP3s, and other portable electronic products. This kind of installation is driven by IC manufacturers and is the main connection between IC and LCD today.
COB is the English &#;Chip On Board&#; abbreviation, that is, the chip is bonding (Bonding) on the PCB, which can greatly reduce the module size, while also reducing costs in terms of price. Since IC manufacturers are reducing the output of QFP (a kind of SMT-type IC, which has four legs) in the production of LCD control and related chips, the traditional SMT method will be used in future products. Gradually replaced.
Whatever COB or COG module, it all with IC bonding,we can provide custom design.
COB LCD displays, LCD module panels for industry
LCD displays each require one or more driver modules (s) to control them. These ICs are either placed directly on a circuit board (as COB or SMD) or as COG (Chip-On-Glass) directly on the LC glass.
In chip on board technology, the semiconductor chip (driver) is glued directly onto a circuit board material and contacted there via bond wires. For protection, the IC and the bonding wires are sealed with a drop of potting compound using chip-on-board technology.
Chip-on-board displays are widespread and cheaper than LCD modules with SMD components. ELECTRONIC ASSEMBLY supplies LCD modules of 1x8 characters (DIP module as COB) up to 4x40 characters (standard displays) in COB technology. Chip-On-Board is increasingly replaced by COG (DOG series).
Buy Chip on Board (COB) displays directly in our webshop.
For more information, please visit our website.
For more information, please visit character lcd module 132 32 custom.